Thermomechanical characterization of thermoplastic polyimide to improve the chain interaction via crystalline domains

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dc.contributor.authorNicholls, Alejandro Rivera
dc.contributor.authorCraft, Garrett
dc.contributor.authorPerez, Yesenia
dc.contributor.authorPellisier, Matthew
dc.contributor.authorStock, John Allan
dc.contributor.authorTestemale, Maxime
dc.contributor.authorKull, Ken
dc.contributor.authorEubank, Jarrod F.
dc.contributor.authorHarmon, Julie P.
dc.date.accessioned2022-09-30T16:16:02Z
dc.date.available2022-09-30T16:16:02Z
dc.date.issued2019-09
dc.description.abstractIn a previous study on polyimides, we incorporated an aromatic diamine monomer with a methylene linker, 4,4'-methylenebis (2,6-dimethylaniline), to make a robust main chain along with aliphatic polyetherdiamine backbone linkers to decrease rigidity. In this report, we explore the behavior of crystalline regions provided by the organized packing of polyethylene oxide into the formerly characterized polymers. The polymers were designed to exhibit thermal properties in between those of conventional aromatic polyimides and polymers with wholly aliphatic ether diamine links, with a target to improve the mechanical characteristics. Through dynamic mechanical analysis and differential scanning calorimetry, it is shown that the incorporation of polyethylene oxide diamine and the removal of methyl pending groups serve to improve the organized packing of the chains. All of this allows for a broader range in tenability of thermal and mechanical properties of the polyimide. Furthermore, the crystalline regions are an important component to maintain the temperature stability of polyimide while maintaining the processability. The polymers are characterized by Fourier-transform infrared spectroscopy, thermomechanical and calorimetric analysis, microhardness measurements, tensile testing, and wide-angle X-ray scattering. INTRODUCTION Highly ordered aromatic backbones allow polyimides (PIs) to have superb properties demonstrated by elevated thermal stability, solvent resistance, low coefficients of thermal expansion, low dielectric constants, high glass transition [...]en_US
dc.identifier.citationNicholls, A. R., Craft, G., Perez, Y., Pellissier, M., Stock, J. A., Testemale, M., Kuli, K., Eubank, J., & Harmon, J. P. (2019). Thermomechanical Characterization of Thermoplastic Polyimide to Improve the Chain Interaction via Crystalline Domains. Polymer Engineering and Science, 59(9), 1919. https://doi.org/10.1002/pen.25194en_US
dc.identifier.issn0032-3888
dc.identifier.urihttps://search.ebscohost.com/login.aspx?direct=true&AuthType=shib&db=edsgao&AN=edsgcl.600664620&site=eds-live&scope=site&custid=s5615486
dc.identifier.uriDOI: 10.1002/pen.25194
dc.identifier.urihttp://hdl.handle.net/11416/807
dc.language.isoen_USen_US
dc.publisherSociety of Plastics Engineers, Inc.en_US
dc.subjectEngineeringen_US
dc.subjectManufacturing industriesen_US
dc.subjectPolyimidesen_US
dc.subjectPolyimides -- Thermal propertiesen_US
dc.titleThermomechanical characterization of thermoplastic polyimide to improve the chain interaction via crystalline domainsen_US
dc.typeArticleen_US

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